Journal article
TSV Antennas for Multi-Band Wireless Communication
IEEE journal on emerging and selected topics in circuits and systems, v 10(1), pp 100-113
Mar 2020
Abstract
On-chip wireless links offer improved network performance due to long distance communication, additional bandwidth, and broadcasting capabilities of antennas. This work challenges the on-chip antenna design conventions, and pushes toward a Through-Silicon Via-based antenna design called TSV_A that establishes multi-band wireless communication through the silicon substrate medium with only a 3 dB loss over a 30mm on-chip distance. The TSV_A performance is evaluated in both Finite Element Method and system-level Network-on-Chip (NoC) simulations. A comparison to traditional wire-based NoCs, analysis of wireless multi-bands, and technology scaling to demonstrate the substantial area improvements compared to traditional wireless NoCs (up to 99.88%) are performed. Simulation results show an improvement in network latency up to ~13% (average improvement of ~7%), energy-delay improvements of ~34% on average, and an improvement in throughput up to ~34% (average improvement of ~23%), using Wireless NoC with multi-band TSV_As. The improved signal performance of TSV_A, and multi-band capabilities, are ideal for wireless intercell communication for programmable metasurfaces with dedicated communication layers.
Metrics
Details
- Title
- TSV Antennas for Multi-Band Wireless Communication
- Creators
- Vasil Pano - Electrical and Computer Engineering Department, Drexel University, Philadelphia, PA, USAIbrahim Tekin - Electronics Engineering Department, Sabanci University, Istanbul, TurkeyIsikcan Yilmaz - Apple Inc., Culver City, CA, USAYuqiao Liu - Electrical and Computer Engineering Department, Drexel University, Philadelphia, PA, USAKapil R Dandekar - Electrical and Computer Engineering Department, Drexel University, Philadelphia, PA, USABaris Taskin - Electrical and Computer Engineering Department, Drexel University, Philadelphia, PA, USA
- Publication Details
- IEEE journal on emerging and selected topics in circuits and systems, v 10(1), pp 100-113
- Publisher
- IEEE
- Grant note
- 1305350 / National Science Foundation (10.13039/501100008982)
- Resource Type
- Journal article
- Language
- English
- Academic Unit
- Electrical and Computer Engineering
- Web of Science ID
- WOS:000521179500010
- Scopus ID
- 2-s2.0-85079679266
- Other Identifier
- 991014877832204721
InCites Highlights
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- Collaboration types
- Industry collaboration
- Domestic collaboration
- International collaboration
- Web of Science research areas
- Engineering, Electrical & Electronic