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TSV-W for 2.5-D IC Wireless Interconnects
Journal article   Peer reviewed

TSV-W for 2.5-D IC Wireless Interconnects

Kyei Anim, Baris Taskin, Amlan Ganguly and Kapil R. Dandekar
IEEE transactions on very large scale integration (VLSI) systems, pp 1-11
2026
DOI: https://doi.org/10.1109/TVLSI.2026.3716542

Abstract

This article introduces the use of through silicon vias (TSVs) connected to electrical switches as waveguides for wireless interconnects on 2.5-D interposer-based integrated circuits (ICs). The resulting wireless interconnect can be controlled at run-time with electrical switches on the TSVs forming the TSV-W(aveguide) (TSV-W). This run-time control allows for creating or blocking wireless interconnects based on the demands of the applications mapped to a multicore computing system. The 3-D finite element method (FEM) simulations of 2.5-D IC floorplans are utilized to demonstrate the utility of TSV-Ws when deployed with wireless interconnects built with TSV-A(ntenna)s (TSV-As). The wireless channel between two TSV-As at a communication distance of 15 mm, representative of distant cores on a 6×6 multicore 2.5-D system, is improved from a 3.6-dB loss without proposed TSV-Ws to a stronger link with only a 2.6-dB loss with TSV-Ws ( 3.125× improvement in bandwidth at −10 dB), primarily due to the directionality imposed by TSV-Ws. Also shown in FEM simulations is a configuration of an orthogonally bent wireless channel on a multicore 2.5-D IC system.

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