Effect of chromium-gold and titanium- titanium nitride-platinum-gold metallization on wire/ribbon bondability

Conference proceeding

Open access

JIANBIAO Pan, Robert M Pafchek, Frank F Judd, Jason Baxter and IEEE

29TH INTERNATIONAL ELECTRONICS MANUFACTURING TECHNOLOGY SYMPOSIUM, v 29, pp 180-185

2004

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https://doi.org/10.1109/iemt.2004.1321657View

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Applied sciences

Design. Technologies. Operation analysis. Testing

Electronics

Exact sciences and technology

Integrated circuits

Microelectronic fabrication (materials and surfaces technology)

Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices

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Title: Effect of chromium-gold and titanium- titanium nitride-platinum-gold metallization on wire/ribbon bondability
Creators: JIANBIAO Pan - California Polytechnic State University
Robert M Pafchek - Agere Systems
Frank F Judd - Agere Systems
Jason Baxter - Yale University
IEEE
Publication Details: 29TH INTERNATIONAL ELECTRONICS MANUFACTURING TECHNOLOGY SYMPOSIUM, v 29, pp 180-185
Conference: 29th international electronics manufacturing technology symposium, 29th (San Jose, California, United States, 14 Jul 2004–16 Jul 2004)
Publisher: IEEE
Resource Type: Conference proceeding
Language: English
Academic Unit: Chemical and Biological Engineering
Web of Science ID: WOS:000223201300038
Other Identifier: 991020200889404721

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Web of Science research areas: Engineering, Electrical & Electronic; Engineering, Manufacturing