Effect of chromium-gold and titanium-titanium nitride-platinum-gold metallization on wire/ribbon bondability

Journal article

Open access

JIANBIAO JIANBIAO PAN, Robert M PAFCHEK, Frank F JUDD and Jason B BAXTER

IEEE transactions on advanced packaging, v 29(4), pp 707-713

2006

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https://doi.org/10.1109/tadvp.2006.884774View

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Integrated circuits

Exact sciences and technology

Microelectronic fabrication (materials and surfaces technology)

Electronics

Applied sciences

Optoelectronic devices

Design. Technologies. Operation analysis. Testing

Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices

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27 citations in Scopus

Title: Effect of chromium-gold and titanium-titanium nitride-platinum-gold metallization on wire/ribbon bondability
Creators: JIANBIAO JIANBIAO PAN - Department of Industrial and Manufacturing Engineering, California Polytechnic State University, San Luis Obispo, CA 93407, United States
Robert M PAFCHEK - Agere Systems, Breinigsville, PA 18031, United States
Frank F JUDD - Agere Systems, Breinigsville, PA 18031, United States
Jason B BAXTER - Chemistry Department, Yale University, New Haven, CT 06520, United States
Publication Details: IEEE transactions on advanced packaging, v 29(4), pp 707-713
Publisher: Institute of Electrical and Electronics Engineers; Piscataway, NY
Resource Type: Journal article
Language: English
Academic Unit: Chemical and Biological Engineering
Web of Science ID: WOS:000241965300006
Scopus ID: 2-s2.0-37849188870
Other Identifier: 991014877865504721

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Collaboration types: Industry collaboration; Domestic collaboration
Web of Science research areas: Engineering, Electrical & Electronic; Engineering, Manufacturing; Materials Science, Multidisciplinary